It uses a 0.100" (2.54 mm) pitch on both the pin-to-pin and row spacing, making it a standard footprint for board-to-board stacking or wire-to-board applications through a mating receptacle. The through-hole solder termination and 0.250" (6.35 mm) mating pin length suit it for PCB interconnect where the header stands off the board at a 0.100" (2.54 mm) insulation height.
Rated 5 A per contact at 110 V — the current is typical for signal-level interconnects on a 0.100" pitch header. The 30.0 µ" (0.76 µm) gold or Gold GXT™ plating on the mating surface gives it a solid mating cycle life for field-service reconnects or repeated board swaps; this is not a tin-plated economy header meant for one-time assembly.