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86503-158HLF — Amphenol product photo

Amphenol FCI 86503-158HLF BERGSTIK II Header, 58 pos

MPN86503-158HLF
Active

Amphenol FCI BERGSTIK® II, Header, 58 Positions, 2 Rows, 0.100" (2.54mm) Pitch, Through Hole, Solder, 5 A, 110 V, Gold or Gold GXT™ 30.0µin (0.76µm) Mating, Unshrouded, Push-Pull, UL94 V-0.

$5.2985Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

86503-158HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions58
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.120\" (3.05mm)
Overall contact length0.470\" (11.94mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.250\" (6.35mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

BERGSTIK® II 86503-158HLF — 58-Position Unshrouded Header

The Amphenol FCI 86503-158HLF is a 58-position, dual-row unshrouded header from the BERGSTIK® II series, on the standard 0.100" (2.54 mm) pitch. It carries 5 A per circuit at 110 V, with gold or Gold GXT™ plating at 30.0 µ" (0.76 µm) on the mating surface — enough margin for repeated mating cycles in a corrosive environment without a cost premium over heavier gold. The through-hole solder tails are 0.120" (3.05 mm) long, and the overall contact length of 0.470" (11.94 mm) gives a 0.250" (6.35 mm) mating interface for secure board-to-board stacking.

Mating and Footprint

The 0.100" row spacing mirrors the pitch, keeping the footprint a simple 2 x 29 grid of 0.028" square pins. For a 58-circuit BOM line, confirm the receptacle has all 58 positions loaded and the same row spacing.

Frequently asked questions

Where can I buy the 86503-158HLF?

The 86503-158HLF is sourced to order against an RFQ through independent distribution. Submit a request with your BOM quantity for current pricing and availability — confirmed at quote time.

What is the mating connector for 86503-158HLF?

This unshrouded header mates with any standard 0.100" (2.54 mm) pitch dual-row receptacle, such as a BERGSTIK® II IDC socket. The mating connector must have 58 positions and the same 0.100" row spacing.

What is the pin pitch and current rating of 86503-158HLF?

The pitch is 0.100" (2.54 mm) on both rows and between rows. It is rated 5 A per circuit at 110 V, with 30 µ" gold plating on the mating contacts.