Board-to-Board Header, 66 Positions, 0.100" Pitch
The Amphenol FCI 86503-166HLF is a 66-position, dual-row unshrouded header from the BERGSTIK® II series. It uses the standard 0.100" (2.54 mm) pitch on both rows and between rows, making it footprint-compatible with a wide range of legacy and current board layouts. Rated at 5 A per contact with a 30 µ" (0.76 µm) gold mating finish, it handles repeated mating cycles and moderate signal-level current without contact fretting. The through-hole solder termination and UL94 V-0 rated black insulator suit it for card-edge and mezzanine board-to-board interconnects inside enclosed equipment.
What the Ratings Mean for Your Fit
The 0.100" pitch is the classic industry spacing — the footprint matches standard 0.100" grid prototyping boards and legacy backplane connectors. The 66 positions in two rows means the board footprint is 33 positions per row, which at 0.100" spacing occupies about 3.3" of board edge per row. The 30 µ" gold on the mating surface is the key spec for reliability: it supports hundreds of mating cycles without exposing the phosphor bronze base metal, so this header is a good fit for field-serviceable cards or test fixtures where the connector sees regular reconnection. The 5 A per contact rating is for signal-level current — it will carry logic-level power and I/O comfortably, but it is not sized for bus-bar or main-rail power distribution.
Sourcing and Lifecycle
The 86503-166HLF carries an Active lifecycle status from Amphenol FCI — full production, no end-of-life notice on record. No official successor or cross-reference is listed, so this is the direct BOM line match for the 66-position dual-row footprint.