It uses a 0.100" (2.54mm) pitch on both the mating interface and row spacing, which is the standard footprint for legacy and new designs alike.
The 100.0µin (2.54µm) tin plating on the mating surface is thick enough for repeated mating cycles in a controlled environment, but tin is a signal-duty finish — if the application sees frequent disconnect or corrosive atmospheres, a gold-plated sibling in the same series would be the better call. The 0.470" (11.94mm) overall contact length breaks down as 0.250" (6.35mm) mating length and 0.120" (3.05mm) post length, which sets the board-to-board stack height and the through-hole solder tail depth. All 12 positions are loaded — no option for selective population on this order code.