Board-to-Board Header for Standard Footprints
The Amphenol 86503-418HLF is an 18-position, dual-row unshrouded male header from the BERGSTIK II series. It uses the industry-standard 0.100" (2.54mm) pitch and row spacing, so it drops onto a standard DIP footprint without board layout changes. The through-hole solder termination and push-pull fastening make it a straightforward pick for prototyping or production runs where a reliable, no-frills board-to-board interconnect is needed.
Key Specs and What They Mean for Your Build
Rated 5 A per contact at 110 V, this header handles signal-level power and general-purpose board interconnection. The 100 µin (2.54 µm) tin plating on the mating surface is noticeably thicker than standard flash tin — it holds up better across repeated mating cycles in a test fixture or field-service scenario. The phosphor bronze contacts offer good spring properties and corrosion resistance for the price point. The UL94 V-0 black PA nylon housing meets the flame rating required for equipment inside an enclosure.