It is a board-to-board interconnect, through-hole soldered, with a 0.100" (2.54mm) pitch on both the pin-to-pin and row-to-row spacing — a standard footprint that matches a wide range of IDC sockets, crimp receptacles, and board-to-board stacking connectors. The 5 A per-contact current rating and 110 V voltage rating place it firmly in the signal-level interconnect class, not power distribution.
Footprint and routing fit
The 0.100" pitch and 0.100" row spacing are the key dimensions for board layout. The 0.250" (6.35mm) mating pin length gives enough engagement depth for standard box headers and IDC receptacles. The 0.120" (3.05mm) solder post length suits a typical 0.062" to 0.093" PCB thickness — the post protrudes enough for a reliable solder fillet without bottoming out on the far side of the board.
The 100.0 µin (2.54 µm) tin plating on the mating surface is thick for a tin finish — it handles the occasional rework cycle but is not specified for repeated field mating. Tin-on-tin contacts are best suited to a single mate cycle in production, then left mated for the life of the assembly.