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Amphenol 86503-464HLF — Pin Headers, Sockets & Housings

Amphenol BERGSTIK II 86503-464HLF, 64-Pin Header

MPN86503-464HLF
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Amphenol ICC BERGSTIK® II 86503-464HLF, 64-position dual-row unshrouded header, 0.100" (2.54 mm) pitch, square male pins, 5 A per circuit, tin-plated mating and post, through-hole solder, UL94 V-0.

$8.3800Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

86503-464HLF key specifications
ParameterValue
SeriesBERGSTIK® II
TypeMale Pin
MountingThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board

All specifications

86503-464HLF additional specifications
ParameterValue
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions64
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.120\" (3.05mm)
Overall contact length0.470\" (11.94mm)
Contact finish - matingTin
Contact length - mating0.250\" (6.35mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

64-Position Dual-Row Unshrouded Header

The Amphenol ICC BERGSTIK® II 86503-464HLF is a 64-position, dual-row unshrouded header on a standard 0.100" (2.54 mm) pitch — the same pitch used across the BERGSTIK II family for board-to-board and wire-to-board interconnect. The square male pins are through-hole soldered, with a mating contact length of 0.250" (6.35 mm) and a post length of 0.120" (3.05 mm) for the PCB side. Rated 5 A per circuit at 110 V, with tin plating on both the mating surface and the solder post — the mating finish is a substantial 100.0 µin (2.54 µm), which gives this header decent corrosion resistance for general-purpose use without the cost of gold.

The 0.100" (2.54 mm) pitch is the classic 0.1-inch grid — it matches the vast installed base of ribbon-cable IDC connectors, BergStrip receptacles, and standard perfboard layouts. The 64 circuits mean this header fills a full 32-pin-per-row footprint; the dual-row layout with 0.100" row spacing keeps the board area manageable at about 1.6" long.

Frequently asked questions

What is the contact plating on the 86503-464HLF?

Both the mating interface and the solder post carry 100µin (2.54µm) of tin — a heavy tin deposit that provides good durability for repeated mating cycles and is suitable for power distribution as well as signal-level connections.