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86503-468HLF — Amphenol product photo

FCI 86503-468HLF BERGSTIK II Header, 68 Pos, 0.100" Pitch

MPN86503-468HLF
Active

FCI BERGSTIK® II unshrouded header, 68 positions, dual-row 0.100" (2.54mm) pitch, through-hole solder termination, tin-plated male pins, 5 A per circuit, UL94 V-0.

$7.2318Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

86503-468HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions68
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.120\" (3.05mm)
Overall contact length0.470\" (11.94mm)
Contact finish - matingTin
Contact length - mating0.250\" (6.35mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

BERGSTIK II Header, 68-Position Dual-Row

The FCI 86503-468HLF is a 68-position, dual-row unshrouded header from the BERGSTIK® II series, built on the standard 0.100" (2.54mm) square grid. The black UL94 V-0 housing and phosphor bronze contacts suit general-purpose board-to-board interconnects inside enclosed equipment.

Footprint and Layout

The 0.100" pitch and 0.100" row spacing define a standard 68-pin footprint that matches legacy backplane and mezzanine layouts. The 0.250" mating pin length provides clearance for the mating receptacle's depth, while the 0.120" solder tail suits a typical 0.062" board thickness. The unshrouded design keeps the keep-out zone tight around the pin tips, which matters when routing traces between rows on the top layer.

Contact Finish and Duty

Frequently asked questions

What is the pinout and row configuration of 86503-468HLF?

The 86503-468HLF is a dual-row header with 68 positions, all loaded, on a 0.100" (2.54mm) pitch with 0.100" row spacing.