The Amphenol 86503-472HLF is a 72-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board interconnect on a standard 0.100" (2.54mm) pitch grid. This is a through-hole, vertical-mount header with push-pull fastening — no locking ramp, so it's suited for internal board stacking where the mated connection is stable and not subject to frequent disconnect or high vibration.
At 72 positions loaded (all positions filled), this is the high-density end of the BERGSTIK® II dual-row unshrouded header family. For comparison, the 67996-432HLF carries 32 positions at the same 0.100" pitch and 2-row layout — a direct footprint match for lower circuit-count boards. The 72-position variant fills a 36-pin-per-row footprint, which means the board layout must accommodate a 3.6-inch (91.44mm) body length along the mating axis. The 0.100" row spacing matches the pitch, so the overall footprint is a standard 0.100" x 0.100" grid — no special routing clearance needed beyond the body outline.
Tin is cost-effective for internal connections that are mated once during assembly and rarely disconnected in the field.