It uses the standard 0.100 inch (2.54 mm) pitch on both rows, making it footprint-compatible with a wide range of BergStik receptacles and IDC connectors. The through-hole solder termination and 0.100 inch post length suit it for board-to-board stacking or wire-to-board applications where the mating half is a receptacle with 0.100 inch row spacing. Rated 5 A per circuit at 110 V, with 30.0 µin gold flash over phosphor bronze contacts, the header handles signal and low-power duty without the risk of tin whisker growth or fretting corrosion in moderate-cycle applications. The UL94 V-0 black housing and push-pull fastening are standard for internal board-level interconnects.
Mating and footprint
The 0.100 inch row spacing and 0.100 inch post length mean the 86832-102HLF mates with any standard BergStik dual-row receptacle or IDC socket that shares the same pitch and row count. The 0.325 inch mating length provides enough wipe for reliable contact in a stacked board assembly. With only 2 positions, this header is typically used for a single signal pair or a low-current power/return pair — not a multi-wire bus.