Board-to-Board Header for Through-Hole Routing
It uses the standard 0.100" (2.54 mm) pitch on both rows and between rows, making it a direct drop-in for legacy 0.100" grid layouts. Rated 5 A per contact at 110 V, with gold or Gold, GXT™ plating at 30.0 µin (0.76 µm) on the mating surface — enough margin for repeated mating cycles in a board-to-board interconnect that sees occasional rework.
The 0.100" (2.54 mm) pitch and dual-row layout match the most common through-hole header footprint on the market — if your board has a 34-position, 0.100" grid, this header drops in.