It uses the standard 0.100" (2.54 mm) pitch on both rows and between rows, so it lands on a 0.100" grid footprint — no layout adjustment needed. Rated 5 A per contact with 30.0 µin (0.76 µm) gold plating on the mating surface, this header is built for repeated mating cycles in board-to-board or wire-to-board signal interconnects.
The 0.100" (2.54 mm) pitch is the legacy DIP/IDC standard — any mating receptacle with the same pitch and 46 positions will fit, but the unshrouded pins require the receptacle to have its own alignment features. Tin-plated siblings would cost less but wear faster under repeated mate cycles.