Skip to main content
Amphenol 86832-156HLF — Pin Headers, Sockets & Housings

Amphenol FCI 86832-156HLF BERGSTIK II Header, 56 Pos

MPN86832-156HLF
Active

Amphenol FCI BERGSTIK® II Series, Board to Board, Header, Male Pin, 56 Positions, 2 Rows, 0.100" (2.54 mm) Pitch, Through Hole, Solder, Gold or Gold GXT™ Contact Finish, 5 A, 110 V.

$4.1909Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

86832-156HLF key specifications
ParameterValue
SeriesBERGSTIK® II
TypeMale Pin
MountingThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board

All specifications

86832-156HLF additional specifications
ParameterValue
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions56
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.100\" (2.54mm)
Overall contact length0.525\" (13.34mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.325\" (8.26mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

BERGSTIK® II 56-Position Unshrouded Header

The Amphenol FCI 86832-156HLF is a 56-position, dual-row unshrouded male header from the BERGSTIK® II series, on a standard 0.100" (2.54 mm) pitch. It is a board-to-board interconnect, designed for through-hole soldering to a PCB, with a push-pull fastening type and an insulation height of 0.100" (2.54 mm). The 56 circuits are all loaded, arranged in two rows with a 0.100" row spacing, making it a dense signal interconnect for parallel board stacking or wire-to-board applications when mated with a matching receptacle.

The contact finish is gold or Gold GXT™ at 30.0 µin (0.76 µm) on the mating interface — this thickness supports repeated mating cycles without contact fretting, making it a good fit for applications that see periodic board swaps or field servicing.

Frequently asked questions

What is the pitch of the 86832-156HLF?

The 86832-156HLF has a 0.100" (2.54 mm) pitch on both the mating interface and the row spacing.