The Amphenol FCI 86832-424HLF is a 24-position dual-row unshrouded header from the BERGSTIK® II series, on the classic 0.100" (2.54 mm) pitch that matches standard DIP footprints and 0.1" grid prototyping boards. All 24 positions are loaded with square male pins, tin-plated on both the mating surface and the solder tails, with a mating contact thickness of 100.0 µ" (2.54 µm).
The 0.100" (2.54 mm) pitch and 0.100" (2.54 mm) row spacing mean this header drops onto a standard 0.1" grid — no footprint surprises if your board layout uses legacy DIP or BergStik-compatible patterns. With 100 µ" of tin on the mating side, you get a solid initial connection, but tin-on-tin interfaces are prone to fretting corrosion under vibration or repeated thermal cycling. This header is best suited for low-mating-cycle applications — think one-time assembly or infrequent rework — rather than a field-serviceable interconnect.
No official cross-reference or direct equivalent is on record — the BERGSTIK® II series includes many 24-position dual-row headers, but pin length and plating options vary, so confirm the 0.525" (13.34 mm) overall contact length and 0.100" (2.54 mm) post length match your board stack-up before committing.