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Amphenol 86832-430HLF — Pin Headers, Sockets & Housings

Amphenol BERGSTIK II 86832-430HLF, 30-Pos Unshrouded Header

MPN86832-430HLF
Active

Amphenol FCI BERGSTIK® II, unshrouded header, 30 positions, 2 rows, 0.100" (2.54mm) pitch, through-hole solder, tin-plated contacts, 5A per circuit, 110V, UL94 V-0.

$5.0800Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Jul 2026

Specifications

86832-430HLF key specifications
ParameterValue
SeriesBERGSTIK® II
TypeMale Pin
MountingThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board

All specifications

86832-430HLF additional specifications
ParameterValue
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions30
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.100\" (2.54mm)
Overall contact length0.525\" (13.34mm)
Contact finish - matingTin
Contact length - mating0.325\" (8.26mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

The Amphenol FCI 86832-430HLF is a 30-position, dual-row unshrouded header from the BERGSTIK® II series, built on the industry-standard 0.100" (2.54 mm) pitch. Typical use is as a general-purpose board-to-board or wire-to-board header on a PCB, often paired with a matching IDC or crimp receptacle in harness assemblies or mezzanine stacks.

No official cross-reference or second-source part is listed in the series documentation, so the BOM should be built around this exact order code without assuming a drop-in alternate.

Frequently asked questions

What is the current rating of 86832-430HLF?

The header is rated 5 A per circuit. This is a signal-level rating on the 0.100" (2.54 mm) pitch — adequate for logic power and I/O, but not intended for bus-level power distribution.

What is the pitch of 86832-430HLF?

The mating pitch is 0.100" (2.54 mm), the standard DIP footprint spacing. The row-to-row spacing is also 0.100" (2.54 mm).