Board-to-Board Header for Through-Hole Stacking
It uses a 0.100" (2.54mm) pitch on both the pin-to-pin and row spacing, which matches the standard footprint for IDC ribbon-cable sockets and many dual-row receptacles. The through-hole solder termination and 0.100" (2.54mm) post length suit it for perpendicular or parallel board stacking where the mating half is a female socket on a separate PCB. The 100.0µin (2.54µm) tin plating on the mating contact surface provides a durable oxide barrier for repeated mating cycles in controlled environments — not a high-cycle or corrosive-duty part, but adequate for most internal board interconnects where the mated pair stays put.
As an unshrouded push-pull header, the 86832-432HLF mates with any standard 0.100" pitch, dual-row, 32-position female socket that accepts 0.025" square pins — the common BERGSTIK, Dubox, or similar receptacle families. The 0.100" (2.54mm) post length on the solder tail gives a through-hole standoff that clears the PCB surface for wave or hand soldering. The overall contact length of 0.525" (13.34mm) — 0.325" (8.26mm) mating section plus 0.100" (2.54mm) post — defines the stack height budget between boards when the header is mounted on one board and mated to a socket on another.
The BERGSTIK II series includes many 32-position variants differing by plating grade (tin vs gold), post length, or packaging — confirm the BOM line against the mating half and board footprint before committing.