The Amphenol BERGSTIK II 86832-470HLF is a 70-position, 2-row unshrouded male header on the standard 0.100" (2.54mm) pitch, designed for through-hole board-to-board stacking. The tin-plated contacts — 100.0 µ" (2.54 µm) on the mating surface — carry 5 A per circuit at 110 V, which is typical for signal-level duty rather than power distribution. The 0.100" insulator stand-off and 0.525" overall contact length suit it for parallel board stacking where the mated height is set by the mating receptacle's own tail length.
The 0.100" pitch and 0.100" row spacing are the legacy 2.54 mm grid — any standard 0.100" header footprint on the PCB will accept this part.
Plating and duty
The 100.0 µ" (2.54 µm) mating-side thickness is generous for tin, giving good wear resistance for the expected cycle life. For high-cycle or corrosive environments, a gold-plated variant of the BERGSTIK II would be the right pick.
It is a standard catalog part in the BERGSTIK II series, so production is ongoing. No official cross-reference or direct substitute is on record for this exact 70-position, 2-row, unshrouded, tin-plated configuration — the BOM line is specific to this order code.