Board-to-Board Header for Low-Density Interconnects
The FCI 86837-102HLF is a 2-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board stacking applications where a low-profile, solder-through-hole connection is needed. The 0.100" (2.54mm) pitch and 0.100" row spacing match standard perf-board and prototyping layouts, making this a common choice for power or signal jumpers between two PCBs. Rated 5A per contact with a 110V voltage limit, each square pin carries enough current for modest power rails or I/O lines without forcing a larger connector footprint. The unshrouded design exposes the male pins — easier to probe during debug and simpler to clean, but offers no polarization or mechanical protection against mis-mating. The 30.0µin gold or GXT™ finish on the mating surface supports repeated connect-disconnect cycles without fretting corrosion, while the phosphor bronze contact material provides spring retention over the connector's service life. The header is loaded on all 2 positions, with a total contact length of 0.600" (15.24mm) — the mating section is 0.380" (9.65mm) and the solder tail extends 0.120" (3.05mm) below the insulator. The black UL94 V-0 rated housing suits equipment requiring a flame-rated enclosure.
Sourcing and Lifecycle
The 86837-102HLF carries an Active lifecycle status from the manufacturer — no end-of-life notice, no last-time-buy window. No official direct replacement or cross-reference is on record for this order code.