Board-to-board header for parallel PCB stacking
The Amphenol BERGSTIK II 86837-114HLF is a 14-position, dual-row, 0.100" (2.54 mm) pitch through-hole header designed for board-to-board interconnect. It carries square male pins with gold or GXT plating at 30.0 µin on the mating surface — a plating grade that handles repeated mating cycles without fretting corrosion, unlike a tin-plated contact that would degrade after a few insertions. The unshrouded design means the pins are exposed; the mating receptacle provides the polarization and keying. Rated 5 A per circuit at 110 V, this header is sized for signal-level power distribution across parallel PCBs in a mezzanine stack.
What the key ratings mean for your fit
The 0.100" (2.54 mm) pitch is the standard 0.1-inch grid — your PCB footprint needs a matching 2.54 mm hole pattern, and the dual-row layout with 0.100" row spacing means the 14 positions occupy a 7-pin-per-row footprint. The 5 A per circuit rating is per-contact at the stated voltage; derate above ambient temperature per the manufacturer's curve. The 30.0 µ" gold plating on the mating side supports hundreds of mating cycles — this is not a one-time solder-and-forget contact. The UL94 V-0 housing is the standard flame rating for equipment inside an enclosure.