The FCI BERGSTIK® II 86837-130HLF is a 30-position, dual-row unshrouded header on a 0.100" (2.54 mm) pitch — the same spacing on both the pin-to-pin and row-to-row axes. This puts it on the standard 0.100 x 0.100-inch grid that matches legacy perfboard layouts and common IDC socket strips. Rated 5 A per contact with a 110 V voltage ceiling, it carries signal-level current; the limiting factor is the pin density and the 30 µinch gold or GXT plating on the mating surface, which supports repeated mating cycles in board-to-board stacking applications. The through-hole solder termination and 0.120" (3.05 mm) post length suit it for standard PCB thicknesses without a long-tail rework.
As an unshrouded header with push-pull fastening, this part mates with any standard 0.100-inch pitch, 30-position dual-row socket strip or IDC receptacle that accepts a square 0.025-inch pin. The 0.380" (9.65 mm) mating pin length gives enough reach for a standard box-header or low-profile socket. The 0.100" (2.54 mm) insulation height means the plastic base sits low to the board, leaving the full pin length exposed for the mating connector. For a build-to-print BOM, you need the mating receptacle and terminals separately — the header alone is one half of the interconnect.