Board-to-Board Header for Dense Pin Arrays
The Amphenol ICC 86837-154HLF is a 54-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board interconnects on a standard 0.100" (2.54 mm) pitch grid.
Pitch and Footprint — Standard Grid Fit
The 0.100" (2.54 mm) pitch and 0.100" row spacing match the prototyping grid, so the footprint fits a standard perforated board or a custom PCB layout without special routing.
The phosphor bronze base material provides spring retention without stress relaxation over the connector's service life. For a board-to-board signal interconnect where the header stays mated, the gold thickness supports the mating cycle count without degradation.