It is a board-to-board interconnect, designed for through-hole soldering into a PCB.
The 0.100" row spacing matches the industry-standard 0.100" pitch grid, so the footprint is a straightforward 60-hole through-hole pattern. The overall contact length of 0.600" (15.24 mm) breaks down into a 0.380" (9.65 mm) mating tail and a 0.120" (3.05 mm) solder post — the post length is short enough to clear most board thicknesses without bottom-side interference. For a 60-position dual-row header, the 0.100" insulation height (2.54 mm) above the board surface is standard.
