Board-to-Board Header for Standard-Density Stacking
With a 0.100" (2.54mm) pitch on both rows and contacts, it provides a familiar footprint for through-hole soldering onto a PCB. The tin-plated mating surface, at 100.0 µin (2.54 µm) thickness, suits moderate-cycle-count connections where cost per position matters more than gold's corrosion margin.
The 110 V voltage rating aligns with the 0.100" pitch creepage distance for standard digital and low-voltage analog circuits.
This unshrouded header mates with any standard 0.100" pitch dual-row receptacle that accepts 0.025" square pins — common choices include FCI's own BERGSTIK II socket strips or equivalent industry-standard IDC and crimp receptacles. The through-hole termination with a 0.120" (3.05mm) post length suits standard PCB thicknesses around 1.6 mm. The overall contact length of 0.600" (15.24mm) gives a mated stack height in the 0.500" range, typical for mezzanine card spacing.