Board-to-Board Header for Legacy Footprints
It uses the industry-standard 0.100" (2.54mm) pitch on both rows and between rows, making it a direct footprint match for legacy 0.100" grid board layouts and for mating with standard IDC ribbon cable receptacles. All 28 positions are loaded — no depopulated rows to account for in the BOM. The through-hole solder termination with a 0.120" (3.05mm) post length suits standard PCB thicknesses in the 1.6mm range. The overall contact length of 0.600" (15.24mm) gives a 0.380" (9.65mm) mating interface — enough to reach the bottom of a standard box header or IDC socket.
The tin-on-tin contact interface (100.0µin or 2.54µm on the mating side) is cost-effective for applications with limited mating cycles, typically under 50 cycles.
Mating and Compatibility
As an unshrouded header with a push-pull fastening system, this mates with any standard 0.100" (2.54mm) pitch IDC socket or box header that accepts 28 positions in a dual-row configuration. The 0.380" (9.65mm) mating pin length is compatible with most standard IDC receptacles and DIP sockets. No keying or polarization — orientation is set by the PCB footprint.