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86837-464HLF — Amphenol product photo

Amphenol FCI BERGSTIK II 86837-464HLF

MPN86837-464HLF
Active

Amphenol FCI BERGSTIK® II, Header, 64 Positions, 2 Rows, 0.100" (2.54mm) Pitch, Through Hole, Solder, Tin, 5A, 110V, Unshrouded, Black

$8.3800Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

86837-464HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions64
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.120\" (3.05mm)
Overall contact length0.600\" (15.24mm)
Contact finish - matingTin
Contact length - mating0.380\" (9.65mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

The Amphenol FCI 86837-464HLF is a 64-position unshrouded male pin header from the BERGSTIK® II series, arranged in two rows of 32 on the standard 0.100" (2.54 mm) pitch. It's the kind of header you reach for when you need a dense, unkeyed signal interconnect on a standard DIP footprint — think backplane breakouts, test fixture interfaces, or any parallel bus that needs 64 lines on a single connector.

The 0.100" (2.54 mm) pitch is the bread-and-butter grid for DIP packages and 0.025" square pin receptacles — if your board already routes to that spacing, this header drops in without a footprint change. The 64 positions (two rows of 32) fill a full 64-pin DIP pattern, which is a common density for parallel I/O or backplane signal distribution.

Frequently asked questions

What is 86837-464HLF's listed style on this component line?

The listed style is Board to Board — this connector is designed for board-to-board stacking applications using a dual-row 0.100 inch (2.54 mm) pitch footprint.

What series does the 86837-464HLF belong to?

The 86837-464HLF is a member of the Amphenol FCI BERGSTIK II series, a dual-row unshrouded header family built on the standard 0.100 inch pitch.