66-Position BERGSTIK II Header for Board-to-Board Stacking
The 5A per-contact rating at the 0.100" pitch is typical for signal-level current in a BERGSTIK header. Derate above 25°C ambient — the UL94 V-0 housing handles the heat, but the unshrouded pins radiate less than a shrouded header. For power distribution, keep each pin under 3A to stay well below the temperature rise ceiling. The 100 µ" tin-plated mating finish is thick enough for 50-100 mating cycles in a production or lab environment. Tin is fine for moderate-duty board stacking, but if the assembly sees frequent reconnections or vibration in the field, consider a gold-plated sibling from the same series — tin frets under micro-motion and the contact resistance drifts over time. The 0.100" pitch and 0.100" row spacing give a 2.54mm grid that matches standard perfboard and prototyping layouts. The 0.600" overall contact length with a 0.380" mating pin means the mated stack height is roughly 0.220" (5.6mm) plus the receptacle height — confirm the board spacing against the mating half's insulation height.