The Amphenol FCI 86840-110HLF is a 10-position, dual-row BergStik® II unshrouded header on 0.100" (2.54mm) pitch — the standard legacy grid for board-to-board and wire-to-board interconnects. Rated 5A per contact at 110V, with 30.0µin (0.76µm) gold plating on the mating surface and phosphor bronze contact material. UL94 V-0 black insulation.
The 0.230" (5.84mm) post length is sized for standard 0.062" to 0.093" board thicknesses. No board lock or additional retention feature; the solder joints carry the mechanical load. This gives the board layout engineer maximum access for probing or routing traces between rows, but requires the mating receptacle to be aligned manually.
The gold or Gold, GXT™ option listed means the actual plating alloy may vary by production lot, but the minimum thickness is held. For power distribution above 3A per circuit, consider derating or moving to a higher-pitch header.