The FCI (Amphenol) 86840-112HLF is a 12-position, dual-row unshrouded header from the BergStik® II series, on the standard 0.100" (2.54mm) pitch. It is a board-to-board interconnect with male square pins, terminated through-hole in a right-angle orientation — designed for parallel-to-PCB mating in space-constrained enclosures. The mating finish is 30.0µin (0.76µm) gold over phosphor bronze contacts, rated 5A per circuit at 110V, with a UL94 V-0 black insulator.
What the ratings mean for fit
The 0.100" (2.54mm) pitch on a dual-row layout means the footprint matches standard 0.1" perfboard and legacy BergStik patterns — the row spacing is also 0.100" (2.54mm), so the through-hole grid is 0.100" x 0.100". All 12 positions are loaded, so the BOM count is fixed at 12 circuits. The 5A per-contact rating is typical for signal-level headers; the limiting factor is the contact cross-section and the 30°C temperature rise in the housing, not the gold plating. The 30.0µin gold on the mating surface supports repeated mating cycles — this is a field-serviceable interconnect, not a one-time solder joint.
Mounting and orientation
Right-angle through-hole mounting places the header flush to the board edge, with the mating interface parallel to the PCB — this is the standard orientation for mezzanine or daughtercard connections where the mating receptacle approaches from the side. The unshrouded design means there is no keying or polarization ramp; the mating half must be aligned by the board layout or a separate alignment feature. The push-pull fastening type relies on friction from the square pins — no locking latch, so vibration resistance depends on the mating receptacle's retention force.
Sourcing and lifecycle
The 86840-112HLF carries an active lifecycle status — no end-of-life notice on record, no last-time-buy trigger. No official successor or cross-reference is listed for this order code.