The Amphenol 86840-124HLF is a 24-position, dual-row BergStik® II unshrouded header on 0.100" (2.54mm) pitch — the standard grid for legacy through-hole board-to-board interconnects. All 24 positions are loaded; no partial-population variant here.
5A per contact at the 0.100" pitch is the standard current ceiling for this series — adequate for signal-level duty and moderate power distribution on a single board. The 30.0µin (0.76µm) gold plating on the mating surface supports repeated mating cycles without oxide buildup; this is not a high-cycle connector but handles periodic board swaps in test or production fixtures. The 0.318" (8.08mm) mating pin length gives enough reach for standard receptacle housings without bottoming out. The push-pull fastening relies on friction from the receptacle contact beams; in high-vibration environments a locking housing or secondary retention is worth considering.
Through-hole, right-angle mounting with 0.230" (5.84mm) post length — the solder tails sit through the board and are wave-soldered. The 0.100" row spacing mirrors the pitch, keeping the footprint on a standard 0.100" grid. Insulation height of 0.190" (4.83mm) above the board surface leaves clearance for trace routing under the body.