The Amphenol 86840-136HLF is a 36-position, dual-row unshrouded header from the BERGSTIK® II series, built on the standard 0.100" (2.54mm) pitch. All 36 positions are loaded, so the footprint matches the circuit count one-for-one with no unpopulated holes to manage. Rated 5A per contact with a 110V voltage rating, the 30.0µin (0.76µm) gold plating on the mating surface handles repeated connect-disconnect cycles without oxidation creep — the gold thickness is the real differentiator here, not the headline current. The right-angle through-hole termination means the solder tails extend 0.230" (5.84mm) below the insulator body — standard for a 0.062" to 0.093" board thickness. The unshrouded design gives visual access to the pin tips during alignment, which speeds hand-assembly but leaves the contacts exposed to incidental contact — a trade-off worth noting for high-vibration environments where a shrouded header would be preferred.
The 0.100" (2.54mm) pitch and 0.100" (2.54mm) row spacing place this header on the standard DIP footprint grid — the same hole pattern as a legacy IC socket or a 0.100" shrouded header.