It uses a 0.100" (2.54 mm) pitch in a dual-row arrangement, with all 38 positions loaded. The right-angle orientation and through-hole solder termination suit it for board-edge I/O connections where the mating axis runs parallel to the PCB.
The 0.100" pitch matches the standard DIP footprint, so this header drops onto a 2.54 mm grid without board layout changes. The 38 positions in two rows give 19 per row, which is a common count for parallel bus or ribbon-cable interfaces. Rated 5 A per contact, but the unshrouded design and gold-plated mating finish (30.0 µin / 0.76 µm) signal this is a signal-duty header, not a power interconnect.