It's a board-to-board interconnect built for through-hole, right-angle mounting — the pins sit parallel to the PCB plane, which suits mezzanine or perpendicular card stacking where the connector lives at the board edge. The 0.100" (2.54mm) pitch is the standard square-grid footprint, so the board layout matches any legacy 0.100" pattern. Rated 5A per circuit at 110V, with gold or Gold GXT™ plating at 30µin (0.76µm) on the mating surface — the plating grade supports repeated mating cycles without contact fretting, a common failure in tin-plated headers under vibration.
The 42 positions, all loaded, match a 42-circuit BOM line exactly — no depopulated rows to track. The 0.100" pitch drives the board footprint: each pin lands on a 0.100" grid, and the dual-row layout with 0.100" row spacing means the through-hole pattern occupies a 0.100" × 0.100" matrix. That's a standard footprint shared across the BergStik II family, so a layout drawn for a 40-position header in the same series takes the same pad pattern — just shorter.
Right-angle through-hole termination: the pins exit the body and bend 90°, so the connector sits flush against the board edge with the pin tips extending 0.230" (5.84mm) past the board underside. The mating pin length is 0.318" (8.08mm) — long enough to engage a standard box-header or IDC receptacle with a 0.190" (4.83mm) insulation height.