It uses a 0.100" (2.54 mm) square grid — the same pitch on both the mating interface and the row spacing — which matches the standard 0.100" IDC socket footprint. The contacts are phosphor bronze with a 30.0 µ" (0.76 µm) gold or Gold GXT™ finish on the mating surface, rated for 5 A per circuit at 110 V.
The 0.100" pitch is the industry-standard 2.54 mm spacing — it is the same footprint used by virtually all 0.100" IDC sockets, DIP packages, and BergStrip receptacles. The right-angle orientation and 0.230" (5.84 mm) post length mean the header stands off the board by 4.83 mm at the insulator, with the solder tails long enough for a standard 1.6 mm PCB.
There is no latch or locking ramp; retention relies on the contact interference fit and, in production, on the board-to-board stack or a separate locking header. Termination is through-hole solder; the right-angle pins are inserted into plated through-holes and wave-soldered.