The Amphenol 86840-162HLF is a 62-position dual-row unshrouded header from the BERGSTIK® II series, built for board-to-board interconnect on a standard 0.100" (2.54 mm) pitch grid.
The 0.100" pitch matches the legacy 2.54 mm grid common on prototyping boards and many production PCBs — the footprint is straightforward, with no tight routing constraints. 62 positions loaded across two rows (2×31) means the header fills a dense BOM line; the row spacing is also 0.100", so the board footprint is a standard 0.200"-wide dual-row pattern. Gold plating at 30.0 µ" gives good corrosion resistance and supports moderate mating cycles for field-service or repeated board swaps.
Right-angle through-hole termination — the pins emerge from the bottom of the housing at 90° to the mating axis. The contact length on the post side is 0.230" (5.84 mm), enough for a standard 0.062" board thickness with room for a solder fillet. Push-pull fastening keeps insertion and extraction simple, relying on the contact friction for retention.