The Amphenol FCI 86840-406HLF is a 6-circuit, dual-row unshrouded header from the BERGSTIK II series, designed for board-to-board interconnect. It uses a 0.100" (2.54mm) pitch on both the mating interface and row spacing — a standard footprint that matches legacy 0.100" grid layouts. The right-angle through-hole termination places the pin rows parallel to the PCB, suited for board-edge or mezzanine connections where the mated pair runs parallel to the board surface. Tin-plated phosphor bronze contacts carry a 5 A per circuit rating at 110 V, with a 100.0 µin (2.54 µm) tin mating finish. The black UL94 V-0 rated housing and push-pull fastening make this a straightforward, no-latch header for internal board stacks where vibration is controlled.
What the ratings mean for the fit
The 0.100" (2.54mm) pitch is the key footprint dimension — it dictates the PCB hole pattern and the mating receptacle's contact spacing. At 5 A per circuit, the current rating is typical for signal-level duty and light power distribution; the limiting factor is the temperature rise through the tin-plated contact interface, not the bulk phosphor bronze. The 100.0 µin (2.54 µm) tin mating finish is a thick, cost-effective plating suited for moderate mating cycles (typically 25–50 cycles) in controlled environments. Tin is not rated for frequent field-service reconnection or corrosive atmospheres — if the assembly sees repeated unmating or outdoor exposure, a gold-plated sibling in the BERGSTIK II family would be the better call. The right-angle orientation means the header stands off the board at 0.190" (4.83mm) insulation height, with a 0.230" (5.84mm) solder tail for through-hole wave soldering.