Board-to-Board Header for Dense Parallel Interconnects
It is a board-to-board interconnect component with a 0.100" (2.54 mm) pitch on both the rows and the mating interface, making it a direct fit for standard 0.100" grid PCB layouts. The right-angle, through-hole mounting orientation places the mated board parallel to the carrier board, which is the typical arrangement for mezzanine or expansion card connections where height clearance is tight.
Key Electrical and Mechanical Ratings
Each tin-plated phosphor bronze contact is rated for 5 A.
Tin-Plated Contacts and Mating Cycles
Tin is the workhorse plating for connectors that mate a few times in their service life — it forms a hard, self-cleaning oxide layer that breaks through on wipe during insertion.
Mechanical Fit and Board Layout
The base product number is 86840, which covers the dual-row, 0.100" pitch BergStik II header family.