It uses 0.100" (2.54mm) pitch on both the pin-to-pin and row spacing — the same grid as legacy DIP packages, so the footprint drops onto a standard 0.100" hole pattern without layout changes.
Rated 5 A per contact. That is the current ceiling per pin at room ambient — derate for elevated temperature or if all 72 pins carry current simultaneously, as the housing's heat rise limits the aggregate load. The tin-on-tin contact interface (100.0 µin tin on the mating side, tin on the post) is cost-effective for low-cycle applications where the connector mates once and stays. For frequent mating or corrosive environments, gold-plated siblings in the BERGSTIK II family are the better call. The 0.230" solder post length suits boards up to about 0.093" thick — verify the board thickness against the post length to ensure the solder fillet forms properly on the far side.
No shroud — the header is unshrouded, so the mating receptacle aligns by the pin grid alone without a polarization key.