It uses the standard 0.100" (2.54 mm) pitch on both rows, making it a drop-in fit for any 0.1" grid prototype board or production PCB layout. Rated for 5 A per contact at 110 V, with 30.0 µin (0.76 µm) gold or GXT™ plating on the mating surface over phosphor bronze, it handles signal-level power distribution and repeated mating cycles without the contact resistance drift you get from thin flash or tin plating.
The 0.100" (2.54 mm) pitch and 0.100" (2.54 mm) row spacing define the PCB footprint: eight 0.025" square pins in two staggered rows, 0.100" apart. The 0.120" (3.05 mm) solder post length is short enough for single-sided boards but will protrude through a standard 1.6 mm PCB — check your board thickness and solder fillet clearance. The 0.770" (19.56 mm) mating pin length gives plenty of reach for a shrouded receptacle or a stacking header.
Compared to the Samtec TSW-104-07-S-D, which is also an 8-position (2×4) unshrouded header on 0.100" pitch with 5 A rating and gold plating, the 87052-108HLF is a functional equivalent in fit and electrical ratings. The key difference is the sourcing channel and the manufacturer's own test data — the Amphenol FCI part uses a 30.0 µ" gold or GXT™ finish, while the Samtec part typically uses a 10 µ" or 30 µ" gold depending on the suffix. Both are active and interchangeable for most board layouts, but verify the mating pin length against your receptacle: the 87052-108HLF has a 0.770" (19.56 mm) mating length, which is longer than the TSW-104-07-S-D's standard 0.230" (5.84 mm) pin length, so it will not fit a low-profile stacking application.