BERGSTIK II Unshrouded Header — 14 Positions, 0.100" Pitch
It uses a standard 0.100" (2.54 mm) pitch on both rows and between rows, making it a direct footprint match for legacy and current board-to-board designs. The male pins are square, through-hole solder type, with gold or GXT™ plating on the mating surface rated at 30.0 µin (0.76 µm) thickness. Rated at 5 A per contact at 110 V, with a UL 94 V-0 rated black thermoplastic housing, this header is suited for inside-the-enclosure board interconnects where signal and moderate power routing share a common pitch.
This unshrouded header uses a push-pull fastening type and mates with standard 0.100" pitch IDC socket strips or crimp receptacle housings that accept the same 2.54 mm row spacing. The 0.770" (19.56 mm) mating pin length provides ample wipe for socket contacts. The solder tails are 0.120" (3.05 mm) long, designed for through-hole soldering into a standard PCB.