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87052-118HLF — Amphenol product photo

Amphenol FCI 87052-118HLF BERGSTIK II Header, 18 Pos

MPN87052-118HLF
Active

Amphenol FCI BERGSTIK® II, 18 Position, 0.100" (2.54mm) Pitch, Dual Row, Through Hole, Unshrouded Header, Male Pin, Gold Plating, 5A, 110V, UL94 V-0.

$2.5700Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
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Specifications

87052-118HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions18
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.120\" (3.05mm)
Overall contact length0.990\" (25.15mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.770\" (19.56mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

BERGSTIK II Unshrouded Header — 18-Position, 0.100" Pitch

It uses a 0.100" (2.54 mm) square-pin grid on both the mating pitch and row spacing — a standard footprint that matches legacy and current board layouts.

Rated 5 A per circuit at 110 V, the 87052-118HLF is sized for signal-level and moderate power interconnects — think I/O, control, or low-current board-to-board links. The 5 A per-contact rating is typical for a 0.100" pitch header with phosphor bronze contacts; the limiting factor is the pin density and the PCB trace width, not the contact itself. The 30.0 µin (0.76 µm) gold plating on the mating surface gives good corrosion resistance and supports repeated mating cycles in non-sealed environments — a reasonable choice for field-serviceable assemblies. The 0.990" (25.15 mm) overall contact length and 0.120" (3.05 mm) post length mean it suits standard 1.6 mm PCBs; the post protrudes enough for a clean solder fillet on the back side without bottoming out against the board.

What It Mates With

Frequently asked questions

What is the difference between 87052-118HLF and 87052-118RLF?

The primary difference is the contact plating: the HLF suffix indicates gold or gold GXT™ plating (30.0 µin / 0.76 µm on the mating surface), while the RLF suffix designates a tin-plated version. Both share the same 18-position, 0.100" pitch, dual-row, through-hole form factor. Choose the HLF for applications requiring repeated mating cycles or better corrosion resistance; the RLF is a lower-cost option for one-time or enclosed connections.

Can the 87052-118HLF be used for wire-to-board connections?

No, this is a board-to-board header. It is a male pin header designed to mate with a female socket receptacle on another PCB or an IDC cable assembly. For wire-to-board connections, you would need a crimp housing and terminal system (e.g., a BERGSTIK compatible crimp-to-wire receptacle).