Amphenol FCI BERGSTIK II, 87052-120HLF, 20-position dual-row unshrouded header, 0.100" (2.54 mm) pitch, through-hole solder, gold-plated contacts, 5 A, 110 V, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 110V |
| Current rating | 5A |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 20 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.990\" (25.15mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.770\" (19.56mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The through-hole solder tails and push-pull fastening keep the assembly straightforward — no locking hardware, no shrouding to block access during rework.
The 87052 base number covers dual-row, unshrouded through-hole headers at 0.100" pitch. The 87052-120HLF loads all 20 positions. For a BOM that specifies gold-plated mating for cycle life, the HLF is the correct call; the RLF is a cost-down option for one-time or low-cycle assembly.
Both share the same 20-position dual-row footprint and 0.100" pitch. The HLF variant uses gold or Gold, GXT™ plating on the mating surface; the RLF typically uses tin. For applications requiring repeated mating cycles, the HLF gold plating is the better choice.
Rated 5 A per circuit at 110 V — signal-level current, not for power bus duty.