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87052-126HLF — Amphenol product photo

87052-126HLF BERGSTIK II Header, 26 Pos, 0.100" Pitch, 5 A

MPN87052-126HLF
Active

FCI Amphenol BERGSTIK® II Series, Board to Board, Header, 26 Positions, 0.100" (2.54 mm) Pitch, 2 Rows, Through Hole, Solder Termination, 5 A, 110 V

$4.4200Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

87052-126HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions26
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.120\" (3.05mm)
Overall contact length0.990\" (25.15mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.770\" (19.56mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

The FCI Amphenol 87052-126HLF is a 26-position, dual-row unshrouded header in the BERGSTIK® II series, built for board-to-board and wire-to-board signal interconnects where a standard 0.100" (2.54 mm) pitch and through-hole solder termination are the baseline. All 26 positions are loaded with square male pins in phosphor bronze, finished with 30.0 µin (0.76 µm) gold or Gold, GXT™ on the mating surface — a plating grade that supports repeated mating cycles without contact fretting in moderate industrial or telecom environments.

The 0.100" pitch and 0.100" row spacing match a standard 0.100" x 0.100" grid footprint, so board layout tools and protoboards accept it without custom pad patterns.

No crimp tooling needed; this is a board-mount component, so the assembly step is solder only.

Frequently asked questions

Where can I buy 87052-126HLF?

Essential for procurement to identify authorized distributors and ensure genuine parts.

What is the datasheet for 87052-126HLF?

Engineers need detailed specifications to validate fit and performance in their design.

Is 87052-126HLF RoHS compliant?

Regulatory compliance is mandatory for many end products and supply chains.

What is the price of 87052-126HLF?

Budgeting and cost comparison require current pricing data.

Is 87052-126HLF in stock?

Immediate availability affects production schedules and lead times.

What is the mating connector for 87052-126HLF?

System integration requires proper connector pairing to ensure reliable connections.