Board-to-Board Interconnect for Dense PCB Arrays
With a 0.100-inch (2.54 mm) pitch on both rows and positions, it provides a dense but standard grid for routing signals between parallel PCBs. The 30.0 µin gold or GXT plating on the mating surface gives it the cycle life and corrosion resistance for repeated matings in controlled environments, while the UL94 V-0 rated black housing meets the flammability requirements for equipment inside an enclosure.
The 5 A per contact rating is typical for a 0.100-inch pitch header — the limiting factor is the temperature rise in the housing at full load across all 56 positions, so derate the per-contact current if the assembly runs warm. The 110 V voltage rating reflects the creepage distance available on the unshrouded header, adequate for signal-level and low-voltage power interconnects within a board stack. The 0.770-inch (19.56 mm) mating contact length gives substantial wipe before full engagement, ensuring reliable contact even with some board-to-board misalignment. The 0.120-inch (3.05 mm) solder post length suits standard through-hole PCB thicknesses — the post protrudes enough for a solid solder fillet without excessive tail length.
Unshrouded Header — Placement and Polarization
The 0.100-inch insulation height keeps the pin tips low-profile, which helps in tight board stacks.