It uses a standard 0.100" (2.54mm) pitch on both rows and between rows, matching the legacy DIP footprint that board layout engineers know well — no fine-pitch routing or via-in-pad needed. The tin-plated phosphor bronze contacts, 100.0µin (2.54µm) thick on the mating surface, are suited for moderate mating cycles in clean, indoor environments.
The through-hole solder termination with a 0.120" (3.05mm) post length gives a solid mechanical anchor on the board — no SMT tombstone risk during wave solder. The overall contact length of 0.990" (25.15mm) and a mating length of 0.770" (19.56mm) mean the header stands tall above the board, which is typical for a wire-to-board or board-to-board connection where the receptacle sits on a parallel board or a cable harness.