Board-to-Board Header for High-Density Interconnects
It uses a 0.100" (2.54mm) pitch across two rows, with a matching row spacing of 0.100" (2.54mm), making it a direct fit for standard 0.100" grid PCB layouts. Rated at 5A per contact and 110V, this header handles signal and moderate power distribution in a single connector.
The 0.100" (2.54mm) pitch is the industry-standard grid for prototyping and legacy board designs — it gives enough room for one trace between pads on a single-layer board and two traces on a two-layer board with 8 mil lines. The 5A per-contact rating is derated from the 25°C ambient; at elevated temperatures inside an enclosure, the practical limit drops. The tin-plated mating surface (100.0µin / 2.54µm thick) is rated for fewer mating cycles than gold — typically 25 to 50 cycles — so this header is best suited for semi-permanent connections where the board is mated once or a few times in its service life.