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87185-118HLF — Amphenol product photo

FCI 87185-118HLF BERGSTIK II Header, 18 Pos, 0.100" Pitch

MPN87185-118HLF
Active

FCI BERGSTIK® II, 18 Position, 0.100" (2.54mm) Pitch, Unshrouded Header, Through Hole, Solder, 5A, 30.0µin Gold, Black.

$1.4764Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

87185-118HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows1
Pitch0.100\" (2.54mm)
Positions18
Contact length - post0.095\" (2.41mm)
Overall contact length1.238\" (31.45mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating1.043\" (26.49mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

The FCI 87185-118HLF is an 18-position, single-row, unshrouded male pin header from the BERGSTIK® II series. It uses a 0.100" (2.54 mm) mating pitch — the standard spacing for breadboard and legacy bus architectures — and terminates via through-hole solder to the PCB. Rated 5 A per contact at 110 V, it carries 30.0 µin gold on the mating surface over phosphor bronze contacts, with the insulation rated UL94 V-0. This is a board-to-board interconnect: the unshrouded design means the mating receptacle provides all alignment and polarization, so the board layout must account for the absence of a shroud ramp.

What the ratings mean for the fit

The 0.100" pitch is the defining footprint dimension — it matches standard 0.100" grid prototyping boards and legacy backplane headers. The 5 A per contact rating is typical for signal-level and low-power distribution on this pitch; the limiting factor is temperature rise in the unshrouded single-row body, not the contact itself. The 30.0 µin gold plating on the mating surface supports moderate cycle life — suitable for test points, programming headers, or field-service connections where reconnection is expected, rather than a one-time permanent install.

Sourcing and lifecycle

The 87185-118HLF carries an Active lifecycle status per the manufacturer — full production, no end-of-life notice. No official cross-reference or successor is on record.

Frequently asked questions

Where can I buy the 87185-118HLF available via RFQ confirmation?

Contact the storefront with your BOM quantity for a same-day quote.

What is the pitch of the 87185-118HLF?

The 87185-118HLF uses a 0.100" (2.54 mm) mating pitch — the standard spacing for breadboard and legacy bus architectures.

What is the number of positions for the 87185-118HLF?

The 87185-118HLF has 18 positions, all loaded, in a single row.