Board-to-Board Header, 18 Positions, 0.100" Pitch
The Amphenol BERGSTIK II 87185-418HLF is an unshrouded, single-row board-to-board header with 18 positions on a 0.100" (2.54 mm) pitch. It uses square male pins with tin plating on both the mating surface and the solder posts — 100.0 µin (2.54 µm) on the mating side, which is a healthy thickness for a tin finish and will hold up to a reasonable number of insertion cycles in a controlled environment. Rated at 5 A per circuit with a 110 V voltage rating, this header sits in the general-purpose signal range — fine for powering logic boards, driving relays, or carrying low-current loads where the 0.100" pitch gives enough creepage for the voltage without forcing a wide board footprint.
What the Tin Plating Means for Your Application
The 100.0 µin tin-on-phosphor-bronze contact finish is a workhorse choice for cost-sensitive, low-mating-cycle designs. Tin is softer than gold and will oxidize over time, but the thickness here is well above flash-plating levels — it will survive dozens of insertions without fretting if the connector is mated in a clean, dry environment.