It uses the standard 0.100" (2.54mm) pitch that matches legacy DIP footprints and common IDC ribbon cable layouts. Rated 5A per contact at 110V, this is a signal-level interconnect — the 100.0µin tin plating on the mating surface handles moderate insertion cycles in controlled environments, not gold-grade corrosive duty.
Footprint and fit
The 0.100" pitch and 1.043" mating pin length give this header a generous standoff above the board — the 0.100" insulation height leaves room for conformal coating or trace routing under the body. The 0.095" solder post length suits standard 0.062" PCBs; for thicker boards, verify the post protrusion clears the far-side solder fillet. All 23 positions are loaded, so the footprint is a straight row of 23 plated through-holes on 0.100" centers.
As an unshrouded header, this part mates with any standard 0.100" pitch female socket housing or IDC receptacle that accepts 23 positions — no keying feature forces orientation, so the assembly line must align pin 1 visually. The tin-on-tin contact system (mating and post finish both tin) is rated for the full 5A per circuit, but tin interfaces are best suited to applications with limited mating cycles and no exposure to sulfide-rich atmospheres.