The 87409-110LF: The 1.27 mm pitch and 0.130 inch (3.30 mm) mating pin length set the board footprint and the required receptacle depth. The insulation height of 0.226 inch (5.74 mm) plus the mated stack height of 6.42 mm define the z-height budget between parallel PCBs — critical for mezzanine card spacing.
Peer Comparison: 20 vs 30 Positions
The 87409-110LF (20 positions) and the 87409-115LF (30 positions) share identical 1.27 mm pitch, 6.42 mm stack height, 30 µinch gold mating finish, and UL94 V-0 housing. The only parametric difference is the position count — the 30-position variant occupies a longer footprint on the board edge.