30-Position Dual-Row Mezzanine Header at 1.27 mm Pitch
This is a common height for mezzanine cards in compact enclosures where every millimeter counts.
30 µinch Gold Mating Surface and Wide Temperature Range
Surface-Mount with Pick-and-Place and Board Guide
Termination is surface-mount solder, and the header includes a pick-and-place feature for automated assembly — the vacuum pick-up area is clearly defined on the top of the shroud. The contact finish thickness on the post is 100 µinch tin, which wets well and forms a reliable solder joint.
Packaged in Tape & Reel and Cut Tape, it is ready for volume SMT assembly or prototype builds.
